SM Technology, Korea, manufactures quality UV and non-UV dicing tape. We also supply heat release tape for cutting of ceramic packages. For more information, please visit http://www.sm-technology.co.kr/eng/business/business_01_01_01.html .
UV and non-UV dicing tapes for semiconductor wafer and package sawing processes.
The Heat Release Tape provides high adhesion strength to keep work pieces in place but with extremely easy release upon heating.